Akademik Veri Yönetim Sistemi
22nd Congress on Thermal Science and Technology (ULIBTK 2019) , Kocaeli, Türkiye, 11 - 14 Eylül 2019, ss.1-7
It is desirable to keep operating temperatures of
electronic devices stable at low values. The use of a thermoelectric cooler to
work with the device to ensure temperature control is one of the solutions.
However, there are different parameters affecting the performance of the TEC
device. Therefore, determining the optimum parameter is required to improve the
performance of electronic devices. For this purpose, in this study, three
dimensional numerical models have been developed in the use of thermoelectric
self cooling devices which was used as a cooler for electronic devices.
Thermoelectric self-cooling (TSC) is a new thermoelectric application which
provide the cooling of any heat-generating device without electricity
consumption. The aim of this study is to investigate the performance of
thermoelectric coolers used in overheating of electronic devices under
different parameters.