NUMERICAL SIMULATION OF THERMOELECTRIC SELF-COOLING SYSTEM FOR THE COOLING OF ELECTRONIC DEVICES


Arslan F. M. , Şener M., Gürses B. O. , Gürlek G.

22nd Congress on Thermal Science and Technology (ULIBTK 2019) , Kocaeli, Türkiye, 11 - 14 Eylül 2019, ss.1-7

  • Basıldığı Şehir: Kocaeli
  • Basıldığı Ülke: Türkiye
  • Sayfa Sayıları: ss.1-7

Özet

It is desirable to keep operating temperatures of electronic devices stable at low values. The use of a thermoelectric cooler to work with the device to ensure temperature control is one of the solutions. However, there are different parameters affecting the performance of the TEC device. Therefore, determining the optimum parameter is required to improve the performance of electronic devices. For this purpose, in this study, three dimensional numerical models have been developed in the use of thermoelectric self cooling devices which was used as a cooler for electronic devices. Thermoelectric self-cooling (TSC) is a new thermoelectric application which provide the cooling of any heat-generating device without electricity consumption. The aim of this study is to investigate the performance of thermoelectric coolers used in overheating of electronic devices under different parameters.